Guest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling
Type
Journal Article
Year
2023
Publisher
IEEE Transactions on Components, Packaging and Manufacturing Technology
Description
Authors: Tim Persoons, Lorenzo Codecasa
Abstract: Thermal management of electronic devices and systems remains an active research domain, which is increasingly characterized by strong multidisciplinary collaborations, often involving both academic and industry researchers. The growing thermal and reliability demands, increased power density, and an evolving variety of platform and device types are all driving factors behind trends for enhanced co-design of devices involving combinations of electronic, electrical, mechanical, acoustics, and material aspects.
